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Nitric Acid 70 percent semiconductor grade is used in manufacturing processes serving as a chemical bath for cleaning silicon wafers. One of its properties is the elimination of particles and contaminants from the semiconductor surfaces after the etching process. In addition, it enhances the surface smoothness, flatness and removes the oxide layer from the surfaces of semiconductors.This grade exceeds the requirements of Federal Standard A-A-59105 (formerly O-N-350), designed to meet the standards that the SEMI manufacturing industry sets, for electronic uses. The nitrogen-based chemical semiconductor grade allows a broad application of Nitric Acid 70% Solution in various industries, such as solar power, LCD panels, and others.
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- Cleaning silicon wafers
- Solar energy
- Metal processing
- LCD panels
- RAM devices
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Product Information
| CAS | 7697-37-2 |
|---|---|
| Synonyms | Hydrogen nitrate, Aqua fortis, Azotic acid, Salpetersaeure, Nitrooxidanyl |
| Assay | 68-70% |
| PubChem ID | 944 |
| Grade | Semiconductor/Electronic Grade |
| Color | Max 10 |
| Physical form | Liquid |
| Appearance | Clear to pale yellow |
| Odor | Strong acrid |
| pH | 0.1 (1.0N solution) |
| Melting point | -41°C |
| Boiling Point | 120.5°C |
| Solubility | Soluble |
| Molecular formula | HNO3 |
| Molecular weight | 63.013 |
| Arsenic (As) | Max 0.005 ppm |
| Autoship Available | Yes |
| Cadmium (Cd) | Max 0.5 ppm |
| Calcium (Ca) | Max 0.5 ppm |
| Chloride (Cl) | Max 0.5 ppm |
| Heavy metals | Max 0.2 ppm |
| Iron (Fe) | Max 0.2 ppm |
| Lead (Pb) | Max 0.2 ppm |
| Loss on ignition | Max 2 ppm |
| Magnesium (Mg) | Max 1 ppm |
| Phosphate (PO4) | Max 0.2 ppm |
| Sodium (Na) | Max 1 ppm |
| Sulfate (SO4) | Max 0.5 ppm |
| Viscosity | 2.0 cPs |
